Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
CEO: Kevin K. Engel. Company website
Amkor Technology, Inc. (AMKR) trades at $50.30, up 4.90% on the day, as of Sep 20, 2026 15:01 UTC.
Amkor Technology, Inc. has a market capitalisation of $12.50B, calculated from the live AMKR share price and shares outstanding.
AMKR trades at a trailing P/E of 22.56, from earnings per share of $2.23 over the last twelve months.
Amkor Technology, Inc. generated revenue of $7.46B over the trailing twelve months, which puts the stock at 1.68 times sales.
Yes. Amkor Technology, Inc. pays a dividend yielding 0.63% on the current share price.
AMKR has traded between $25.52 and $96.68 over the past 52 weeks, and the last price is 48.0% below that high.
Yes. Amkor Technology, Inc. keeps 7.45% of revenue as net income over the trailing twelve months.
Wall Street analysts rate AMKR Buy, with an average price target of $78.75, 56.6% above the current price.
Amkor Technology, Inc. is classified under the Technology sector and the Semiconductors industry, and is domiciled in US.
Kevin K. Engel is the chief executive of Amkor Technology, Inc., which employs 30,800 people.
QFI Terminal shows AMKR with live charts, full financials, the options chain with gamma exposure, institutional ownership and analyst ratings on one screen. The free plan has no time limit and asks for no card.
Interactive charts, full financials, options chain, gamma exposure, ownership and analyst ratings, all in one institutional-grade terminal.
Open AMKR in Terminal See plans